bond II

Crafted to Perfection

Revolutionary 4nm Dimensity 8350
Slim 1.7mm bezel
50MP with OIS and DCG
Prestigious, Multiple Award-Winning Design

Reddot AwardiF Design Award
Asia Design AwardIDA Design AwardEU Product Design AwardLondon Design AwardNY Product Design Award
Model image

bond II [p]

A slimmer 7.9mm matte fiberglass body
eSIM
Android 16
up to 1024GB storage

bond II [p]

bond II

Revolutionary 4nm Dimensity 8350
Slim 1.7mm bezel
50MP with OIS and DCG

bond II

bond II Lite

Powerful Dimensity 7050
Glass Back Cover
Best Gaming Phone in Its Market Segment
LTPS Technology
50MP EIS Main Camera

bond II Lite

bond Edition

Powerful Dimensity 7050
Glass Back Cover
Best Gaming Phone in Its Market Segment
Dual Curved AMOLED Display
50MP EIS Main Camera

bond Edition

bond

Powerful Dimensity 7050
Glass Back Cover
Best Gaming Phone in Its Market Segment
Dual Curved AMOLED Display
50MP EIS Main Camera

bond